Solder joint failures are among the most common and costly problems in electronics manufacturing. Many defects escape optical or 2D X-ray inspection, only to cause intermittent faults, early-life failures, or recalls. This white paper explores how industrial CT scanning reveals the full 3D structure of solder joints, helping engineers detect, analyze, and prevent the most persistent defects in today’s dense, high-performance assemblies.

Download this white paper and learn how to:

• Identify hidden voids, bridging, and Head-In-Pillow (HiP) defects in BGAs and QFNs
• Compare 2D X-ray and CT imaging to understand their diagnostic limits
• Quantify porosity, misalignment, and solder volume with 3D precision
• Verify compliance with IPC-A-610 and other electronic assembly standards
• Use CT and Voyager software to accelerate failure analysis and process validation

Download the full guide and see how engineers are using Lumafield CT scanning to catch solder defects before they leave the lab.